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倒装芯片焊点中的热迁移
  • 所属机构名称：大连理工大学
  • 会议名称：第十七届全国钎焊及特种连接技术交流会
  • 成果类型：会议
  • 会场：郑州
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： 黄延禄|石永华|杨永强|卫国强|王国荣|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
同项目会议论文
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