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Comparative study on interfacial reactions between Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder balls and ENEPIG
  • 所属机构名称：大连理工大学
  • 会议名称：2011 International Symposium on Advanced Packaging Materials, APM 2011
  • 成果类型：会议
  • 会场：Xiamen, China
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： Yang, F.|Huang, M.L.|Liu, L.W.|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
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