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Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package
  • 所属机构名称：大连理工大学
  • 会议名称：2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, IC
  • 成果类型：会议
  • 会场：Xi';an, China
  • 相关项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
作者： Huang, Mingliang|Liu, Xiaoying|Ye, Song|Chen, Leida|
同会议论文项目
无铅化电子封装钎焊界面反应及焊点可靠性的基础研究
期刊论文 44 会议论文 31
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