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A new self-aligned BOI (Body-on-insulator) finfet fabricated on bulk SI wafers
  • 所属机构名称：北京大学
  • 会议名称：7th International Conference on Semiconductor Technology, ISTC 2008
  • 成果类型：会议
  • 会场：Shanghai, China
  • 相关项目：集成电路工艺研究（包括ＣＡＭ）
作者： Wang, Runsheng|Wang, Yangyuan|Xu, Xiaoyan|Zhuge, Jing|Zhang, Xing|Wang, Wenhua|Chen, Gang|Huang, Ru|
同会议论文项目
集成电路工艺研究（包括ＣＡＭ）
期刊论文 55 会议论文 53 获奖 2 专利 35
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