中文摘要：

相变材料的封装技术是相变材料研究的热点问题和实际应用的技术瓶颈。从相变材料的热力学过程入手，分析了相变材料封装技术在微观热力学层面的必要性，比较了相变材料插层、接枝和微胶囊化3种典型的封装技术的优缺点，结果表明，以无机物封装的定型相变材料具有导热系数大、阻燃性好、力学性能优良等优点，在此基础上，提出了以无机物掺杂或直接以无机物为封装载体的无机／相变定型储能材料的制备方法。

英文摘要：

Packaging technology is the hotspot of the fundamental theory and the technological bottleneck of practical application of phase change materials（PCMs）. In this paper the necessity of packaging technology is introduced just from the thermodynamic process of PCMs, and the advantages and disadvantages of the three typical packa- ging technologies are compared, such as intercalation, graft and microencapsulation. On this basis, the preparation technology of inorganic/shape-stabilized PCMs by doping or packing from inorganic matter is discussed. Finally, the detailed developing direction is put forward in this paper.