针对复合量程微加速度计的封装设计与测试的理论、仿真分析和具体试验测试三个方面进行了详细论述,最终确定出最佳的封装方案.理论分析主要通过对几种典型MEMS封装类型特点的比较,确定了最优的封装类型为陶瓷封装.仿真分析主要通过ANSYS软件进行复合量程加速度计热应力仿真,确定了复合量程加速度计的陶瓷封装管壳的厚度.通过静态特性测试及动态特性测试等进一步验证了该封装结构具有抗过载能力.
A great of work has been done on designing the package of the multi-ranged micro-accelerometer.Through theoretical analysis,simulation testing,as well as specific experiments,the study before giving the best packaging solution is recounted.Theoretical analysis by the characteristics of several typical MEMS package types to find out that the optimal type of package is the use of ceramic package.The ANSYS software is used to simulate the thermal stress simulation,which guides the thickness of the ceramic package shell and the thickness of tube,along with the introduce of selecting some related key technology and package solutions this project needs.The structure of the package of anti-overload is validated for further verification through static characteristics and dynamic characteristics.