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中文摘要：
复合量程加速度计阳极键合过程中产生的残余热应力会引起加速度计的零位失调，也是导致加速度计失效的原因之一。对键合过程中产生的残余热应力进行了研究，仿真并分析了残余热应力与键合温度、玻璃基底厚度和框架键合宽度的影响，确定了适合复合量程加速度计的最佳键合宽度和玻璃基底厚度。
英文摘要：
The residual thermal stress in anodic bonding of muhi-ranged accelerometer can cause zero imbalance of the aecelerometer, but also one of the factors that lead to the failure of the accelerometer. Residual thermal stress generated in the process of anodic bonding is studied, and at the same time, the effect of residual stress and bonding temperature, the thickness of the glass substrate and the frame bonding width are simulated and analyzed, the best width of frame and thickness of the glass substrate are determined.
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