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无铅BGA枕头缺陷的研究
  • ISSN号：1001-3474
  • 期刊名称：《电子工艺技术》
  • 时间：0
  • 分类：TN605[电子电信—电路与系统]
  • 作者机构：[1]上海交通大学微纳科学技术研究院,上海200240, [2]广达上海制造城表面贴装技术实验室,上海201613
  • 相关基金：国家自然科学基金项目（项目编号：50730008）;上海市科技项目（项目编号：09JCl407400,1052nm02000）.
作者： 侯昌锦[1,2], 王会芬[2], 吴金昌[2], 张亚非[1]
关键词： BGA焊点, 枕头缺陷, DOE实验设计, Lead free BGA solder joint, Head-in-Pillow defect, DOE
中文摘要：

BGA枕头焊点的锡膏和锡球完全没有融合成为一体,倒过来看就像头压在枕头上面。介绍了四种有效的检测方法。从设计、材料和工艺三方面分析了枕头缺陷的潜在影响因素。选取PCB玻璃态转化温度、钢网厚度、BGA贴装偏移量和回流焊炉链条速度四个因素进行两水平全因子实验设计,在成功复制枕头缺陷的基础上,分析了各因素的影响作用,得出了链条速度是最显著的影响因素。

英文摘要：

Solder paste and solder ball are not completely fused into one BGA head-in-pillow, Upside down as head on a pillow. Four effective methods for observing are introduced. And analyze the potential factors of this defect from design, materials and process. Then select PCB θg point, stencil thickness, BGA mounting deviant and reflow chain speed as four factors to DOE. After successfully copy the head-in-pillow defect, discuss the effect of all factors. Finally find that the chain speed is the most significant one.

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期刊信息
  • 《电子工艺技术》
  • 主管单位:信息产业部
  • 主办单位:中国电子科技集团公司第二研究所 中国电子学会
  • 主编：吕淑珍
  • 地址：太原市和平南路115号
  • 邮编：030024
  • 邮箱：bjb3813@126.com
  • 电话：0351-6523813
  • 国际标准刊号：ISSN：1001-3474
  • 国内统一刊号：ISSN：14-1136/TN
  • 邮发代号:22-52
  • 获奖情况:
  • 信息产业部优秀科技期刊奖,山西省一级期刊
  • 国内外数据库收录:
  • 被引量:4162