为了描述半导体晶片制造,有效地流动,扩大混合 Petri 网(EHPN ) 的一个新建模方法被建议。到分离部分和复杂影印石版术的连续部分处理的模型,混合 Petri 网(HPN ) 被介绍。为了应付影印石版术的复杂性,处理,象封装和分类那样的面向对象的方法与 HPN 模型一起是综合的。EHPN 定义根据 HPN 模型和面向对象的方法被介绍。面向对象的混合 Petri 子网模型为每个典型物理对象被开发,为过程步建模的 EHPN 被组织。表明建议当模特儿的方法的可行性和有效性,一个真实晶片影印石版术盒子被用来说明当模特儿的过程。当模特儿的结果显示 EHPN 能处理有效地的一个复杂影印石版术过程的动态建模。
To describe a semiconductor wafer fabrication flow availably, a new modeling method of extended hybrid Petri nets (EHPNs) was proposed. To model the discrete part and continuous part of a complex photolithography process, hybrid Petri nets (HPNs) were introduced. To cope with the complexity of a photolithography process, object-oriented methods such as encapsulation and classifications were integrated with HPN models. EHPN definitions were presented on the basis of HPN models and object-oriented methods. Object-oriented hybrid Petri subnet models were developed for each typical physical object and an EHPN modeling procedure steps were structured. To demonstrate the feasibility and validity of the proposed modeling method, a real wafer photolithography case was used to illustrate the modeling procedure. dynamic modeling of a complex photolithography process effectively The modeling results indicate that the EHPNs can deal with the dynamic modeling of a complex photolithography process effectively.