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基于驻留约束的半导体晶圆蚀刻系统实时调度算法
  • 期刊名称:上海交通大学学报
  • 时间:0
  • 页码:1742-1745
  • 语言:中文
  • 分类:TP319.9[自动化与计算机技术—计算机软件与理论;自动化与计算机技术—计算机科学与技术]
  • 作者机构:[1]上海交通大学机械与动力工程学院,上海200240
  • 相关基金:基金项目:国家自然科学基金资助项目(60574054,70771065),上海市浦江人才计划资助项目(07PJ14052)
  • 相关项目:具有集装箱码头作业决策背景的复杂Flow Shop调度问题的建模与优化研究
中文摘要:

为有效利用半导体晶圆蚀刻系统,根据蚀刻系统的特点,进行了实时调度问题域的描述,提出了基于驻留约束的实时调度算法.在此基础上,建立了以无不良品和总完工时间最小为目标的启发式实时调度算法.仿真实验结果表明,该算法是有效和实用的.

英文摘要:

A wet-etching process is a key flow in wafer fabrications. The wet-etching process involves a complex interplay operation of zero wait and no-intermediate storage, and shared robots. To improve the utilities of a semiconductor wafer wet-etching system efficiently, according to characteristics of the wet-etching system, a problem domain of the real-time scheduling was supposed and defined, and strategies of resolving the scheduling problem were proposed. A real-time scheduling algorithm with residence constraints was presented as well. On the basis of the mentioned above, a heuristic real-time algorithm were built for minimizing makespan with no defective wafer. Finally, the performances of the proposed algorithm were analyzed with simulation experiments. The results indicate that the proposed algorithm is valid and practical for generating satisfactory schedule solutions.

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