中文摘要：

随着集成度的增加，高密度的3D IC的发热问题变得越来越严重，温度过高的热斑不仅影响芯片的性能，甚至对芯片的可靠性带来严重的威胁。从两个方面来优化三维芯片的热量问题，通过模拟退火算法把电路模块划分到合适的层，使得热斑块在整体芯片的分布较为均；在x/y方向上对热斑块适当的面积扩张来降低热斑块的功耗密度，然后在z方向上插入散热硅通孔来转移芯片内部的热量。仿真结果表明，通过该优化后的芯片最高温度可以进一步减小，在电路ncpu第二层中优化前后最高温度降低了11．98°；热量分布更加均衡，层内最高温度与最低温度之间的差距进一步缩小最大可以缩减11．82，有效地控制了芯片的温度。

英文摘要：

With the increase of integration, the heat problem of high-density 3D IC is becoming more and more serious.The hotspot caused by over temperature not only affects the performance of the chip , but also brings serious threat to the reliability of the chips.To optimize the heat problem of 3D chip, there are two aspects：1） By simulating annealing algorithm, the circuit module will be divided into the appropriate layer, making the hotspot in a more balanced distribution in the whole chip;2） Reducing the density of the power consumption in the hotspot by expanding the appropriate patch area in the x/y direction, inserting the Thermal Through Silicon Via in the z direction hole to transfer heat within the chip .The experimental results show that the highest temperature chip can be further reduced.After optimization, the highest temperature in the second layer of circuit ncpu lowered 11.98 degrees compared with before optimization , and the heat distribution is more balanced with the optimization .In the layer the maximum and minimum temperature further narrows the gap and the biggest gap can be reduced 11.82, there-fore the temperature of the chip is controlled effectively .