以金属铜为靶材,氧气为反应气体,采用射频磁控溅射法在不同温度的不锈钢基片上制备了氧化铜薄膜电极。采用X射线衍射(XRD)和原子力显微镜(AFM)分别对薄膜的组成和形貌进行了表征分析。电化学测试表明,在基片温度为室温条件下沉积得到的薄膜电极比300℃基片温度沉积得到的薄膜电极首次放电容量高,达到785μAh/(cm^2·μm),但循环100次后后者放电容量较高。用交流阻抗法测得锂离子在氧化铜薄膜中的扩散系数为2.46×10^-15cm^2/s。
Copper oxide thin films were deposited on stainless substrates by reactive RF magnetron sputtering,use a copper target and an oxygen gas atmosphere.The films were characterised by XRD and AFM.The CuO thin films deposited at room temprature delivered higher capacity of 785μAh/(cm^2·μm) in the first discharge process than the films deposited at 300℃,and the latter have better cycling reversibility.The AC impedance show that diffusion cofficience is about 2.46×10^-15cm^2/s.