中文摘要：

随着人们对环境的日益重视和电子封装组装技术的发展，合金焊料的无铅化和质量的要求也越来越高，开发无铅、无毒焊料成为焊料开发的重要方向。介绍了无铅焊料的应用现状及无铅的使用要求，并论述了几种无铅焊料Sn-Ag、Sn-Zn、Sn-Bi系的特点，以及添加其它元素对它们综合性能的影响。

英文摘要：

Recently environment is paid more and more attention and with the development of micro- electronic industry the demand of the quality of lead -free solder is higher and higher, developing no - lead and no-poison solder is important. Discuss the application and requirement of the lead -free solder, which covers Sn - Ag, Sn - Zn, Sn - Bi and so on, meanwhile, discuss the effect of other element in those three solders.