中文摘要：

以次磷酸钠为还原剂的印制线路板化学镀铜为研究对象,采用扫描电镜、交流阻抗和线性极化等测试方法,研究了添加剂L-精氨酸在化学镀铜中的作用和其电化学行为。研究表明,适量的L-精氨酸能明显提高化学镀铜沉积速率,并改善镀层的质量,其最佳质量浓度为0.15mg/L,沉积速率最高可达5.2μm/h,施镀15min后获得的镀层均匀平整。随着L-精氨酸质量浓度的增加,铜阴极还原和次磷酸钠阳极氧化峰电流密度均先增大后减小,阳极氧化峰电位正移,在质量浓度较低（〈0.15mg/L）下,对次磷酸钠氧化和Cu~（2＋）阴极还原有促进作用。

英文摘要：

Taking PCB electroless copper plating（on which using sodium hypophosphite as reducing agent）as research object,the functions and electrochemical behaviors of L-arginine in the electroless copper plating were investigated by SEM,linear polarization and AC impedance tests.The results showed that the proper amount of L- arginine could significantly increase the electroless copper plating speed,and improve the coating quality,the optimum mass concentration of L-arginine was 0.15mg/L,the highest plating speed could up to 5.2μm/h,the uniform and compact coating could be obtained after 15 minutes.With the increase of L-arginine mass concentration,the peak current densities of copper cathode reduction and sodium hypophosphite anodic oxidation would increase first and then decrease,and the anodic peak potential would shift actively.With a low mass concentration（〈0.15mg/L） of L-arginine,the sodium hypophosphite anodic oxidation and copper cathode reduction were enhanced.