中文摘要：

采用电镀法在Fe基体上电沉积Cu膜。用悬臂梁法在线测量了沉积过程中的Cu膜内的平均应力,进而研究了Cu膜内的应力分布及应力来源。结果表明,Cu膜内的平均应力和分布应力均为拉应力,它们均随膜厚的增加而减小。Cu膜内的界面应力很大,而生长应力很小。再者,基于改进的Thomas-Feimi-Dirac（TFDC）电子理论,对Fe基体上Cu膜内由界面应力引起的平均应力做出了初步估算。结果表明,理论估算结果与实验结果的应力性质完全相同,其值也较接近。这说明理论计算模型具有一定的准确性。

英文摘要：

Electroplating was employed to prepare Cu film on Fe substrate.The average internal stress in Cu film on Fe substrate was measured in situ by cantilever beam test.The distribution of the internal stress in Cu film was investigated,and the origin of internal stress was analyzed.The results show that the average internal stress and the distributed internal stress in Cu film were tensile stress and decrease with the increase of film thickness.The interfacial stress in Cu film is very large and the growth stress,which is formed due to film growth,is very small.Meanwhile,the average internal stress in Cu film,which was caused by the interfacial stress,was calculated roughly using a modified Thomas-Feimi-Dirac electron theory（TFDC）.For the same film thickness,the experimental value of the average internal stress and the calculated value had the same sign and were about equal.It shows that the theoretical calculation model of internal stress is of accuracy.