由于军事和商业应用的巨大潜力,红外成像技术至今仍是研究热点之一。针对本课题组提出的基于MEMS和光学读出的新型非制冷红外成像技术,本文一方面通过有限元仿真分析,详细讨论了新型无基底双材料微梁阵列FPA的热转换效率和热变形效率,另一方面通过光学理论分析,详细讨论了光学读出系统在极限操作下的光学测量灵敏度。理论和仿真分析显示,课题组提出的非制冷红外成像技术的NETD的理论极限与当前制冷型红外成像技术的典型指标相当,约为4mK。同时,本文对设计制作的FPA,在构建的系统上进行了红外实时成像实验和理j论仿真分析,显示其系统级NETD已达到110mK。
Infrared imaging technology is still a research focus due to its great application potentials in both military and commercial areas. According to proposed uncooled infrared imaging system based on MEMS and optical readout, the thermal conversion efficiency and the thermo-mechanical sensitivity of new type substrate-free bi-material micro-cantilever array FPA were discussed in detail by using finite element analysis, at the same time the optical measurement sensitivity of optical readout system under limit operation was also discussed in detail by using optical theory. Theoretical and simulation analyses shows that the theoretical limit of NETD for proposed uncooled imaging technology is evaluated to be 4 mK, corresponding to the standard of cooled imaging technology. Moreover, infrared real-time imaging experiment and theoretical analysis were also carried out based on the proposed system. Results show that its NETD was experimentally determined as 110 mK.