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Rapidly Void Detection in TSVs with 2-D X-Ray Imaging and Artificial Neural Networks
  • ISSN号：0894-6507
  • 期刊名称：IEEE Transactions on Semiconductor Manufacturing
  • 时间：2014.5
  • 页码：246-251
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Wang, Fuliang|Wang, Feng|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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