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Modeling and experimental study of a wire clamp for wire bonding
  • 期刊名称：ASME Journal of Electronic Packaging
  • 时间：2015.1.1
  • 页码：011012-
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Fuliang Wang|Fan Dengke|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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