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Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding
  • ISSN号：2156-3950
  • 期刊名称：IEEE Transactions on Components Packaging and Manu
  • 时间：2012.8
  • 页码：1389-1393
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Fuliang Wang|Kang Xiang|L. Han|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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