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High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad W
  • ISSN号：1043-7398
  • 期刊名称：Journal of Electronic Packaging
  • 时间：2014.9
  • 页码：-
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Wang, Fuliang|Li, Junhui|Han, Lei|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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