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Investigation of Complex Looping Process for Thermosonic Wire Bonding
  • ISSN号：0894-6507
  • 期刊名称：IEEE Transactions on Semiconductor Manufacturing
  • 时间：2014.5
  • 页码：238-245
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Wang, Fuliang|Chen, Yun|Han, Lei|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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