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Experiment study of dynamic looping process for thermosonic wire bonding
  • ISSN号：0026-2714
  • 期刊名称：Microelectronics Reliability
  • 时间：2012.6
  • 页码：1105-1111
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Fuliang Wang|Y. Chen|L. Han|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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