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Height measurement of micro-solder balls on metal pad by white light projection method
  • ISSN号：2156-3950
  • 期刊名称：IEEE Transactions on Components Packaging and Manu
  • 时间：2012
  • 页码：1545-1549
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Fuliang Wang|Jingwen Qin|Lei Han|H. Wang|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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