位置：成果数据库 > 期刊 > 期刊详情页
Development of an ultra-long ultra-low n-loop for wire bonding
  • 期刊名称：IEEE Transactions on Semiconductor Manufacturing,
  • 时间：0
  • 页码：-
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Fuliang Wang|Yun Chen|Lei Han|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
同项目期刊论文
Variable-length link-spring model of wire-bonding looping process
Height measurement of micro-solder balls on metal pad by white light projection method
Modeling study of thermosonic flip chip bonding process
Ultrasonic effects in the thermosonic flip chip bonding process
Dynamics of Free Air Ball Formation in Thermosonic Wire Bonding
Effect of Capillary Trace on Dynamic Loop Profile Evolution in Thermosonic Wire Bonding
Modeling of deep cavity looping process on 3D stacked die package
Heavy Aluminum Wire Wedge Bonding Strength Prediction Using a Transducer Driven Current Signal and a
Modeling and Experimental Study of the Kink Formation Process in Wire Bonding
Investigation of Complex Looping Process for Thermosonic Wire Bonding
High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad W
Experimental Study of Thermosonic Gold Bump Flip-Chip Bonding With a Smooth End Tool
Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface
Control System Design for Height Measurement of BGA Balls Based on Timed Automata
Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
Rapidly Void Detection in TSVs with 2-D X-Ray Imaging and Artificial Neural Networks
Comparison of fundamentalfrequency and sweep resistance of different wire loops using finite element
Experimental and Modeling Studies of Looping Process for Wire Bonding
Experiment study of dynamic looping process for thermosonic wire bonding
Modeling and experimental study of a wire clamp for wire bonding