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Variable-Length Link-Spring Model for Kink Formation During Wire Bonding
  • ISSN号：1043-7398
  • 期刊名称：Journal of Electronic Packaging
  • 时间：2013.12
  • 页码：-
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Wang, Fuliang|Tang, Weidong|Li, Junhui|Han, Lei|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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