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Experimental Study of Thermosonic Gold Bump Flip-Chip Bonding With a Smooth End Tool
  • ISSN号：2156-3950
  • 期刊名称：IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANU
  • 时间：2013.6
  • 页码：930-934
  • 相关项目：面向系统级封装的三维大跨度引线成形动力学过程研究
作者： Wang, Fuliang|Han, Lei|
同期刊论文项目
面向系统级封装的三维大跨度引线成形动力学过程研究
期刊论文 22 专利 2 著作 2
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