通过改进工艺参数实现了Cu对SiCp预制型的无压渗透。渗透样块可分为亮色Cu基体区、深黑色渗透区和浅黑色SiC预制型区三部分。分别用X射线衍射仪、扫描电镜和能谱仪对相关试样渗透层的物相、表面形貌和元素分布进行分析,分析认为渗透是在毛细管力和负压机制共同作用下完成。
The pressureless infiltration of SiCp/Cu has been achieved by improving the process parameters. The infiltrated sample can be divided into three parts:bright Cu matrix area,dark black infiltrated area and flat black SiC perform area. The phase,surface topography and elements distributing of the infiltrated layer of the interrelated sample were studied by X-ray diffractometry,scanning electron microscopy and energy spectrometer,and the infiltration was drived by capillary force and negative pressure.