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中文摘要：
在与传统LED散热基板散热性能比较的基础上，分析了国内外功率型LED散热基板的研究现状，介绍了金属芯印刷电路板、陶瓷基板、金属绝缘基板和金属基复合基板的结构特点、导热性能及封装应用，指出了功率型LED基板材料的发展趋势及需要解决的问题。
英文摘要：
On the base of comparison with traditional packaging materials, the present technical research on heat-release substrates of high power LEDs is analyzed. Some new style of substrates（including metal core printed circuit board, ceramic substrates, insulated metal substrates and metal matrix composite substrate） are introduced in the structural characteristics,thermal conductivity and packaging applications. In addition, the research trend and problems to be solved at present of packaging materials are pointed out.
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