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中文摘要：
研究了镀液中主盐浓度对铜基体化学镀的影响,通过测定镀速、硬度、镀层形貌、自腐蚀电位,以确定主盐的最佳使用浓度.结果表明当主盐的浓度为25 g/L时,镀速、耐腐蚀性、硬度适宜,镀层分布均匀、紧凑、颗粒细小.
英文摘要：
The influence of the main salt concentration in plating solution on the chemical composite coating of copper surface is studied. In this paper, the best concentration of the main salt is confirmed by testing the plating speed, hardness and coating morphology and self corrosion potential. Results show when the concentration of the main salt is at 25g/L rate, the planting rate is of the highest, the copper surface has a proper hardness coating and the best corrosion resistance. The distribution of plating on the surface is even, compact and of fine grain.
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