阐述了荧光渗透检测TI-6AI-4V裂纹缺陷的原理,给出了缺陷宽度和缺陷深度公式。研究了荧光渗透检测的工艺过程,通过对TI-6AI-4V裂纹缺陷的试验分析,表明结构曲率变化过大处是产生裂纹缺陷的区域。对TI-6AI-4V裂纹缺陷的产生原因做了理论、模拟分析和试验研究,表明在加工TI-6AI-4V过程中,切削用量是造成应力集中的重要因素,其中切削深度过大会造成裂纹缺陷。
The mechanism of TI-6AI-4V's crack defects is studied,as well as,the crack defects' width and depth of penetration testing formulae are given in the paper. The process of fluorescent penetration testing is analyzed,and the result that detection experiments of TI-6AI-4V structure' s surface crack indicates the changes in the curvature is larger the structure is easier to produce crack defects. The reason that the surface cracks of structure of Ti-6AI-4V is analyzed with theory and simulation,and researched with test. In process of machining TI-6AI-4V,cutting parameters are important factors causing stress concentration,whereas,the larger cutting depth will generate surface cracks.