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中文摘要：
利用“铆钉法”制备了界面为曲面的Cu-Al扩散偶。用光学显微镜和彩色金相技术，研究了烧结过程中界面的迁移情况及其影响因素。研究表明，界面迁移过程受原子的扩散控制；温度是影响界面迁移的主要因素，保温时间是次要因素；试样烧结过程中Cu／Al界面双向迁移并且向Al侧迁移的程度较大。
英文摘要：
Cu-Al diffusion couples with curving interfaces were prepared by mechanical method. With the help of optical microscope（OM） and color metallograph, interface migration and its influencing factors were investigated during sintering. The results show that interface migration was controlled by atomic diffusion, temperature was the major influencing factor on the interface migration while holding time was the second one. The original Cu/Al interface migrated towards both Cu and Al, and more towards A1 during sintering.
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