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中文摘要：
采用“铆钉法”制备了界面为曲面的Ti—Cu扩散偶。用光学显微镜和彩色金相技术，研究了真空保温过程中界面的迁移情况及其影响因素。结果表明，界面迁移受原子扩散控制；温度、保温时间是影响扩散的主要因素。
英文摘要：
Ti-Cu diffusion couples with curving interfaces were prepared by mechanical method. With the help of optical microscope （OM） and color metallography, the interface migration and its influencing factors were investigated during vacuum holding process. The results show that interface migration is controlled by atomic diffusion;temperature and holding time are the major influencing factors on the interface migration.
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