中文摘要：

利用扫描电子显微镜和电子探针对不同退火处理的Al/Cu镶嵌式扩散偶扩散溶解层的形态和形成机理进行了研究。结果表明,当580℃保温160h退火处理后,在Al/Cu界面处形成厚度约2.5mm的扩散溶解层,其主要结构相与Al-Cu相图上相的排列位置一致。CuAl相层首先在Cu上形成,接着CuAl2在Al上形成,然后Cu4Al3、Cu5Al3、Cu3Al2、Cu9Al4和Cu3Al等五个相层依次在Cu上形成,各个扩散溶解层按照平面式长大方式长大;Al-Cu扩散溶解层的形成是Al和Cu固相扩散、溶解与二次结晶的结果,由于扩散浓度和固溶度的相互作用,导致了扩散溶解层析出的序列性。

英文摘要：

By means of SEM and EDS, the microstructure and forming mechanism of diffusion-solution zone in Al/Cu diffusion couple made by inlaying aluminium wire in copper were researched under different annealing conditions. The results show that the diffusion-solution zone with thickness of 2.5mm is formed at Al/Cu interface after heating at 580℃ for 16Oh, in which all phases in Al/Cu binary alloy phase diagram are observed. CuAl phase layer firstly formes on Cu, in succession, CuAl2 formes on Al, and then Cu4 Al3, Cu5 AI3, Cu3 Al2, Cu9 AI4 and Cu3 Al phase layers form in sequence on Cu by growing with a plane mode. The formation of Al/Cu diffusion-solution zone is resulted from diffusion, dissolution and secondary crystallization of Al and Cu in solid phase. The interaction of concentration and solubility in the process of Al/Cu diffusion and solution results in the sequence of the phases in diffusion-solution zone.