中文摘要：

采用粉末烧结的方法制备出了Cu／Sn扩散溶解层；利用光学和电子显微镜观察了该扩散溶解层的形貌，用X射线衍射和能谱技术分析了该扩散溶解层的相组成；依据TFDC电子理论对Cu／Sn扩散溶解层的结构进行了讨论。研究发现，Cu粉和Sn粉在200℃，10h的烧结过干旱中，Sn原子不断扩散进入到Cu晶体中，在Cu粉和Sn粉颗粒界面处，先后依次形成一定厚度的Cu6Sn5、Cu81Sn22、Cu39Sn11和Cu327.92Sn88.08金属间化合物扩散溶解层，该扩散溶解层的结构为Cu相、界面Cu／Cu327.92Sn88.08、Cu327.92Sn88.08相、界面Cu327.92Sn88.08／Cu39Sn11、Cu39Sn11相、界面Cu39Sn11／Cu81Sn22、Cu81Sn22相、界而Cu81Sn22／Cu6Sn5、Cu6Sn5相、界面Cu6Sn5／Sn；4种金属间化合物相呈“层”状分布。

英文摘要：

The Cu/Sn diffusion dissolve layer of powder interfaces was formed using the technology of powder sinter. The feature of diffusion dissolve layer was observed by optics and electron microscope, the phase of layer was analysed by AES and X-ray diffraction. The structure of diffusion dissolve layer was discussed with Thomas-Fermi-Dirac-Cheng （TFDC） model. The results show that Sn atoms could diffuse continuously into Cu particles, Cu6Sn5, Cu81Sn22, Cu39Sn11 and Cu327.92Sn88.08 diffusion dissolve layer was formed early or late and one by one on the interface of Cu powder and Sn powder during sintering on given sinter condition （200℃, 10 h）. Moreover, the four intermetallic compounds possess corresponding thickness. The structure of diffusion dissolve layer is Cu phase, Cu/Cu327.92Sn 88.08 interface, Cu327.92Sn 88.08 phase, Cu327.92Sn 8808/Cu39Sn11 interface, Cu39Sn11 phase, Cu39Sn11/CU81Sn22 interface, Cu81Sn22 phase, Cu81Sn22/Cu6Sn5, Cu6Sn5 phase and Cu6Sn5/Sn interface. In addition, the four intermetallic compounds distribute with state of ＂layer＂.