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中文摘要：
针对激光加工在金属材料焊接、熔覆、表面硬化等工业领域的应用,考虑到半导体激光器体积和重量小、效率高、免维护、成本低以及波长较短等特点,设计了功率达2 kW的半导体激光加工光源。在大通道工业水冷条件下,采用48只出射波长分别为808,880,938,976 nm的传导冷却半导体激光阵列作为发光单元,最终研制出了2 218 W高亮度光纤耦合模块。此高亮度模块可以实现柔性加工,直接应用于金属材料焊接、熔覆、表面合金化等工业领域,对于半导体激光器在工业领域的应用具有重要意义。
英文摘要：
The laser processing is widely used in the welding of metallic materials,cladding,surface hardening,and other industrial fields.The semiconductor laser has many advantages,such as small volume and weight,high efficiency,maintenance-free,low cost,short wavelength,and so on.In this paper,a 2 218 W high-brightness fiber-coupled module was designed and overall assembled by using 48 conduction cooled diode laser arrays as light-emitting units under a major thoroughfare of industrial water-cooling condition.The emitting wavelength of the diode laser arrays were 808,880,938,976 nm,respectively.The high brightness module can make the flexible manufacturing directly applied in the industrial.
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