提出了用CuCl2溶液浸渍还原法制备C/SiC—Cu复合材料的新工艺。对还原工艺进行了初步探讨;用XRD、EDS、SEM研究复合材料的微观形貌及组成;用三点弯曲测定C/SiC—Cu复合材料的弯曲强度。结果表明:影响增重率的主要因素为C/SiC原料的气孔率和浸渍还原次数。Cu在复合材料中呈颗粒状或块状,它不仅渗入到纤维束间,还渗入到纤维间的微孔中。Cu的渗入对C/SiC复合材料的三点弯曲强度基本无影响。
A new process of preparation of C/SiC-Cu composite by copper dichloride saturated solution infiltration and reduction was investigated. The conditions of reduction were studied primarily. The phase identification and microstructure of the C/SiC-Cu composite were analyzed by XRD, EDS and SEM. Mechanical properties were evaluated by the three point flexural test. The results show that the main influencing factors of mass gain are porosity and repeat times. It has been observed that the particle-like or block-like Cu infiltrates into the pores among fiber bundles, also among the filaments. The infiltration of Cu hardly has any effect on the flexural strength of C/SiC Cu composite.