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Effect of bonding parameters on microstructures and properties during TLP bonding of Ni-based alloy
  • 期刊名称：Trans. Nonferrous Met. Soc. China
  • 时间：2012
  • 页码：2112-2117
  • 相关项目：多功能防热陶瓷基复合材料研究
作者： T.S. Lin, H.X. li, P. He, X. Yang, Y.D. Huang, L.|
同期刊论文项目
多功能防热陶瓷基复合材料研究
期刊论文 209 专利 54
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连接工艺参数对镍基高温合金TLP连接接头组织和性能的影响(英文)
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