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连接工艺参数对镍基高温合金TLP连接接头组织和性能的影响(英文)
  • ISSN号：1003-6326
  • 期刊名称：Transactions of Nonferrous Metals Society of China
  • 时间：2012.9.15
  • 页码：2112-2117
  • 分类：TG425.1[金属学及工艺—焊接]
  • 作者机构：[1]浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室,杭州310030, [2]哈尔滨工业大学先进焊接与连接国家重点实验室,哈尔滨150001
  • 相关基金：国家自然科学基金资助项目（51275135,51321061）
  • 相关项目：原位自生反应复合钎焊连接陶瓷/金属的方法及机理研究
作者： 林铁松|李海新|何鹏|杨雪|黄玉东|李亮|韩冷|
关键词： 纳米银, 液相化学还原法, 低温连接, silver nanoparticle, aqueous chemical reduction, low-temperature sintering
中文摘要：

采用液相化学还原法制备出平均粒径为20--35nm的纳米银,并考察不同温度及PVP用量对纳米银性质的影响。结果表明：当硝酸银与PVP的质量比为1∶4、反应温度为30℃时,纳米银的平均粒径最小,为22.4nm,且其团聚程度最小,粒径分布最佳。在压力10MPa、温度200℃、保温30min的烧结条件下,利用制得的纳米银配制焊膏,连接纯度为99.9%的无氧紫铜板,通过扫描电镜（SEM）观察烧结接头截面形貌,可见烧结界面连接紧密,接头组织有孔隙存在。

英文摘要：

Silver nanoparticles with average diameter of 20-35 nm were prepared by aqueous reduction method,and the influence factors of nanoparticles characteristics,such as reaction temperature and PVP concentration,were investigated during reduction process.The results show that monodispersity of nanoparticles is remarkably improved while unfavorable agglomeration is avoided with the AgNO3/PVP mass ratio of 1∶4at the reaction temperature 30℃,and the average diameter of silver nanoparticles reaches the mininum of 22.4nm.Copper pads with the purity of 99.9%are successfully bonded at200℃ and under the pressure of 10 MPa for 30 min,using sintering paste employing fresh silver nanoparticles.Morphology of the bonding joint is analyzed with scanning electron microscope（SEM）,the interface is compacted tightly and porous sintering characteristic is confirmed.

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漂珠尺寸对35%漂珠/铝硅酸盐聚合物复合材料组织结构与性能的影响
微弧氧化生物活性TiO2基纳米结构表面磷灰石诱导能力与药物上载及释放
AlN添加量对BN基复合陶瓷物相组成、微观结构及力学性能的影响
Mechanical properties and plasma erosion resistance of BNp/Al2O3-SiO2 composite ceramics
AlN添加量对BN基复合陶瓷热学性能与抗热震性的影响
TiAl与Ni基合金接触反应钎焊接头界面组织及性能
Cr含量对（TiBw＋TiCp）／（Ti-4．0Fe-7．3Mo-xCr）复合材料组织及性能的影响
TiAl/Ni基合金反应钎焊接头的微观组织及剪切强度(英文)
TiAl基合金与Ni基合金钎焊连接接头界面组织及性能
Al_2O_3/Cu-Sn-Ti+B钎料/Ti-6Al-4V合金连接的微观结构及力学性能
Development of Interface Reaction Layer between TiAl Alloy and 42CrMo Brazing Joints and Its Effect
GH99合金液相扩散连接界面组织分析
保温时间对TiAl合金与镍基合金扩散连接界面组织结构及连接强度的影响
Al2O3/Cu-Sn-Ti+B钎料/Ti-6Al-4V合金连接的微观结构及力学性能
Microstructural evolution and mechanical properties of the joint of TiAl alloys and C/SiC composites
Effects of hydrogen on diffusion bonding of TiAl-based intermetallics using hydrogenated Ti6Al4V int
凝固方式对Sn-Bi钎料组织和性能的影响
合金元素对Sn-57Bi无铅钎料组织及韧性的影响
TiAl合金与镍基高温合金的扩散连接
Cu + TiB2 composite filler for brazing Al2O3 and Ti-6Al-4V alloy
Effect of bonding parameters on microstructures and properties during TLP bonding of Ni-based super
Microstructural investigation of in situ TiB whiskers array reinforced ZrB2-SiC joint
Al2O3/TC4合金钎焊接头中TiB晶须对接头组织结构及力学性能的影响
Microstructure and shear strength of reactive brazing joints of TiAl/Ni-based alloy
ZrC—SiC复合陶瓷扩散焊接头界面组织及力学性能
Ti-Ni钎料钎焊连接ZrC—SiC复合陶瓷接头的界面组织
纳米尺度连接技术的研究现状与展望
用复合中间层扩散连接钛铝基合金与镍基合金
TiAl／Ti／Nb／GH99扩散连接接头的界面组织结构及接头强度
工艺参数对Al2O3／TC4合金接头界面组织及力学性能的影响
Cu＋B复合钎料配比对Al2O3／TC4合金钎焊接头界面组织的影响
TiAl/Ti/GH99扩散连接接头应力的数值模拟
水轮机叶片热喷涂技术研究现状及展望
非晶合金连接的进展现状
生成相性质及其对TiAl合金／42CrMo钢钎焊接头力学性能影响
控制气氛下的AgCuTi/TiAl润湿铺展动力学
中国有色金属焊接材料的发展现状及展望
形成金属间化合物颗粒增强焊缝的TiAl与钢钎焊机理及工艺
温度对AgCu/光滑TC4体系润湿铺展动力学的影响
论电子商务环境中企业财务管理的对策
期刊信息
  • 《中国有色金属学报：英文版》
  • 中国科技核心期刊
  • 主管单位:中国科学技术协会
  • 主办单位:中国有色金属学会
  • 主编：黄伯云
  • 地址：中国长沙中南大学
  • 邮编：410083
  • 邮箱：f-xsxb@csu.edu.cn
  • 电话：0731-88830949
  • 国际标准刊号：ISSN：1003-6326
  • 国内统一刊号：ISSN：43-1239/TG
  • 邮发代号:42-317
  • 获奖情况:
  • 国家“双百”期刊,第二届全国优秀科技期刊评比二等奖,中国有色金属工业总公司优秀科技期刊一等奖
  • 国内外数据库收录:
  • 俄罗斯文摘杂志,美国化学文摘（网络版）,荷兰文摘与引文数据库,美国工程索引,美国剑桥科学文摘,美国科学引文索引（扩展库）,英国科学文摘数据库,日本日本科学技术振兴机构数据库,中国中国科技核心期刊
  • 被引量:1159