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中文摘要：
目前，在我国封装设备的研发中，机械精度设计大多采用仿照类比和经验设计，很少系统地定量分析设备总体精度与相关零部件精度的对应关系。针对此问题，以多体系统理论为基础，结合某型号倒装芯片键合机的特殊结构，建立了倒装芯片键合机的几何误差模型。并对基于几何误差模型进行精度设计的思路进行了探讨，为倒装芯片键合机合理的精度设计提供参考。
英文摘要：
At present,in the research and development of IC packaging equipment,the mechanical precision design mostly re-lies on modeled analog and experience. The relationship between the overall accuracy of device and precision of parts has not been ana-lyzed systematically. To solve this problem,combined with the special structure of flip-chip bonding equipment,the geometric error model of the flip-chip bonding equipment was established based on multi-body system theory. In addition,the accuracy design based on geometric error model was studied. It provides reference for the systemic and reasonable accuracy design of flip-chip bonding equip-ment.
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