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In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid int
  • ISSN号：0021-8979
  • 期刊名称：Journal of Applied Physics
  • 时间：2014.5.28
  • 页码：204907 (影响因子: 2.183)-
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Zhao, Ning|Ma, Haitao|Zhao, Huijing|Huang, Mingliang|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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