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Effect of Electromigration on the Type of Drop Failureof Sn3.0Ag0.5Cu Solder Joints in PBGA Packages
  • ISSN号：0361-5235
  • 期刊名称：Journal of Electronic Materials
  • 时间：2015.10.1
  • 页码：3927-3933 (影响因子: 1.798)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, M.L.|Zhao, N.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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