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Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads
  • ISSN号：0957-4522
  • 期刊名称：Journal of Materials Science: Materials in Electro
  • 时间：2015
  • 页码：933-942 (影响因子: 1.569)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, M. L.|Yang, F.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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