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EFFECT OF ELECTROLESS Ni-P CONSUMPTION ON THE FAILURE MECHANISM OF SOLDER JOINTS DURING ELECTROMIGRA
  • ISSN号：0412-1961
  • 期刊名称：Acta Metallurgica Sinica
  • 时间：2013.1.11
  • 页码：81-86 (影响因子: 0.548)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang Mingliang|Zhou Shaoming|Chen Leida|Zhang Zhijie|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
同项目期刊论文
Effect of Electromigration on Interfacial Reaction in Ni/Sn/Ni-P Solder Joint
Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder
电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响
分步法电镀制备的Au-Sn共晶凸点的微观组织
Current-induced interfacial reactions in Ni/Sn-3Ag-0.5Cu/Au/Pd(P)/Ni-P flip chip interconnect
Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder
A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn-9Zn/
Cu-Ni cross-solder interaction in Cu/Sn-58Bi/Ni interconnect undergoing liquid-solid electromigratio
Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnect
Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
In situ study on reverse polarity effect in Cu/Sn-9Zn/Ni interconnect undergoing liquid-solid electr
Characters of multicomponent lead-free solders
Effect of Cu-Ni cross-solder interaction on liquid-solid interfacial reaction in Cu/Sn/Ni solder joi
Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid-soli
Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electromigr
均恒磁场对Cu与液态SnZn合金间化合物层结晶行为的影响(英文)
电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒装焊点界面反应的影响
Influence of Rare Earth Ce Addition on the Microstructure, Properties and Soldering Reaction of Pure
Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in su
Microstructure and interfacial reaction of Sn-Zn-x(Al,Ag) near-eutectic solders on Al and Cu substra
Ni-P消耗对焊点电迁移失效机理的影响
Cu-Ni交互作用对Cu/Sn/Ni焊点液固界面反应的影响
液态Sn-Cu钎料的黏滞性与润湿行为研究
Electromigration Reliability of Lead-free Solder Interconnects
Liquid-state and solid-state interfacial reactions between Sn-Ag-Cu-Fe composite solders and Cu subs
In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering
Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu so
In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction
Composition control of co-electroplating Au-Sn deposits using experimental strategies
Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing electromi
Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration
Effect of Electromigration on the Type of Drop Failureof Sn3.0Ag0.5Cu Solder Joints in PBGA Packages
Reverse polarity effect in Ni/Sn-9Zn/Ni interconnect undergoing liquid-solid electromigration
Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eu
液-固电迁移Ni/Sn-9Zn/Ni焊点反极性效应研究
Size effect on tensile properties of Cu/Sn–9Zn/Cu solder interconnects under aging and current stres
In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid int
Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu Joints
Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substrates -
Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction o
Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bum
In Situ Study on Current Density Distribution and Its Effect on Interfacial Reaction in a Soldering
EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS
Fe粉对Sn-3Ag-0.5Cu复合钎料组织及性能的影响
Cu-Ni交互作用对Cu／Sn／Ni焊点液-固界面反应的影响
Cu/Sn-58Bi/Ni焊点液-固电迁移下Cu和Ni的交互作用
电迁移对Ni／Sn3．0Ag0．5Cu／Au／Pd／Ni—P倒装焊点界面反应的影响
Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints
Different Diffusion Behavior of Cu and Ni Undergoing Liquidesolid Electromigration
期刊信息
  • 《金属学报》
  • 中国科技核心期刊
  • 主管单位:中国科学协术协会
  • 主办单位:中国金属学会
  • 主编：柯俊
  • 地址：沈阳文化路72号
  • 邮编：110016
  • 邮箱：shxiao@imr.ac.cn
  • 电话：024-23971286
  • 国际标准刊号：ISSN：0412-1961
  • 国内统一刊号：ISSN：21-1139/TG
  • 邮发代号:2-361
  • 获奖情况:
  • 第一、二届全国优秀科技期刊评比一等奖,第一、二、三届国家期刊奖,国家期刊方阵"双高"期刊,第一、二、三届中国科学院科技期刊评比一等奖,中国科学院优秀期刊特别奖,第一、二、三、五届中国科协优秀科技期刊评比一等奖,中国科协精品期刊工程A类、B类,第一、二、三、四、五届中国百种杰出学术期刊,首届出版政府奖
  • 国内外数据库收录:
  • 俄罗斯文摘杂志,美国化学文摘（网络版）,荷兰文摘与引文数据库,美国工程索引,美国剑桥科学文摘,美国科学引文索引（扩展库）,日本日本科学技术振兴机构数据库,中国中国科技核心期刊,中国北大核心期刊（2004版）,中国北大核心期刊（2008版）,中国北大核心期刊（2011版）,中国北大核心期刊（2014版）,中国北大核心期刊（2000版）
  • 被引量:26785