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Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in su
  • ISSN号：0925-8388
  • 期刊名称：Journal of Alloys and Compounds
  • 时间：2014.7.25
  • 页码：281-284 (影响因子: 2.999)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, M. L.|Yang, F.|Zhao, N.|Yang, Y. C.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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