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Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bum
  • ISSN号：1359-6454
  • 期刊名称：Acta Materialia
  • 时间：2015.11
  • 页码：98-106 (影响因子: 4.465)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, M. L.|Zhao, J. F.|Zhang, Z. J.|Zhao, N.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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