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Microstructure and interfacial reaction of Sn-Zn-x(Al,Ag) near-eutectic solders on Al and Cu substra
  • ISSN号：0957-4522
  • 期刊名称：Journal of Materials Science: Materials in Electro
  • 时间：2014.5
  • 页码：2311-2319 (影响因子: 1.569)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, M.L.|Hou, X.L.|Kang, N.|Yang, Y.C.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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