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Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip-chip solder bumps undergoing electromi
  • ISSN号：0884-2914
  • 期刊名称：Journal of Materials Research
  • 时间：2014.11.14
  • 页码：2556-2564 (影响因子: 1.647)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, Mingliang|Zhang, Zhijie|Zhou, Shaoming|Chen, Leida|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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