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In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction
  • ISSN号：0167-577X
  • 期刊名称：Materials Letters
  • 时间：2015.1.15
  • 页码：42-45 (影响因子: 2.269)
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Huang, M. L.|Yang, F.|Zhao, N.|Zhang, Z. J.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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