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Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnect
  • ISSN号：2045-2322
  • 期刊名称：Scientific Reports
  • 时间：2015.8.27
  • 页码：13491 (影响因子: 5.578)-
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： Zhong, Y.|Huang, M. L.|Ma, H. T.|Dong, W.|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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