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Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substrates -
  • ISSN号：1938-5862
  • 期刊名称：ECS Transactions
  • 时间：2013
  • 页码：753-758
  • 相关项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响
作者： M.L. Huang|F. Yang|N. Zhao|X.Y. Liu|
同期刊论文项目
单晶基体界面反应及其对微细无铅焊点可靠性的影响
期刊论文 61 会议论文 47 获奖 6 专利 1
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